Voltage controlled oscillator, composite module, and communication apparatus

ABSTRACT

A resonant circuit includes a choke coil, a variable-capacitance diode, coupling capacitors, a resonant capacitor, a resonator defining an inductor element, and a bypass capacitor. An amplifying circuit includes a buffer amplifying transistor, an oscillating transistor, bias resistors, Colpitts capacitors, bypass capacitors, a coupling capacitor, a choke coil, a resonant capacitor, and a resonant inductor. A bias resistor has one end electrically connected to the base of the oscillating transistor and has the other end electrically connected to the ground via the resonator having one end electrically grounded.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a voltage-controlled oscillator, acomposite module, and a communication apparatus.

2. Description of the Related Art

FIG. 5 is a circuit diagram of a conventional voltage-controlledoscillator 1. The voltage-controlled oscillator 1 includes a resonantcircuit 2 and an amplifying circuit 3. The resonant frequency of theresonant circuit 2 changes according to a control voltage Vc applied toa control terminal 4. The amplifying circuit 3 oscillates a signal basedon the resonant frequency of the resonant circuit 2 and amplifies thesignal.

Referring to FIGS. 6 and 7, the circuits 2 and 3 of thevoltage-controlled oscillator 1 typically include various electroniccomponents (described below) mounted on or formed inside a circuitsubstrate 10, which is produced by integrally firing multilayeredceramic sheets having circuit patterns or ground electrodes printedthereon. In FIGS. 6 and 7, the circuit substrate 10 includes a controlterminal 4, a driving power terminal 5, an output terminal 6,inter-layer connecting terminals 7 to 9, and a ground terminal G. Thecircuit substrate 10 further includes wiring patterns 12 a to 12 e, avia hole 11 a, and a through-hole 11 b. In addition to the componentsdescribed above, the circuit substrate 10 has on its upper surface otherwiring patterns, via holes, and through-holes, which are not shown inFIGS. 6 and 7.

The resonant circuit 2 includes a choke coil L1, a variable-capacitancediode D1, coupling capacitors C9 and C10, a resonant capacitor C11, aresonator (strip line or microstrip line) SL2 which is an inductorelement, and a bypass capacitor C12.

The amplifying circuit 3 includes a buffer amplifying transistor Tr1, anoscillating transistor Tr2, bias resistors R1, R2, R3, and R4, Colpittscapacitors C4, C5, C6, and C7, bypass capacitors C1 and C3, a couplingcapacitor C2, a choke coil (strip line or microstrip line) SL1, aresonant capacitor C8, and a resonant inductor (strip line or microstripline) SL3 which is an inductor element.

Japanese Unexamined Patent Application Publication No. 11-74727discloses another well-known voltage-controlled oscillator, which has adifferent circuit from that according to preferred embodiments of thepresent invention. In this voltage-controlled oscillator, the emitter ofa transistor is connected to the ground not only via a capacitor and abias resistor, but also via a resonator connected to a node between thebias resistor and the capacitor.

Referring again to FIG. 5, the bias resistor R3 in the amplifyingcircuit 3 has one end electrically connected to the base of thetransistor Tr2 and the other end directly connected to the ground. Oneapproach for connecting the bias resistor R3 to the ground is via thewiring pattern 12 a that is provided on the circuit substrate 10, asshown in FIG. 6, so as to electrically connect the bias resistor R3 tothe ground terminal G.

This approach, however, prevents chip components from being mounted inan area S1 because the area S1 overlaps the wiring pattern 12 a.Therefore, this approach is not appropriate for compact design of thevoltage-controlled oscillator 1. Another disadvantage of this approachis that the space available for a microstrip line is reduced which makesit difficult to form the resonator SL2 as a small-loss microstrip line.

Another approach, as shown in FIG. 7, is to form the through-hole 11 bin the circuit substrate 10 such that the through-hole 11 b electricallyconnects the bias resistor R3 to a ground electrode (not shown in thefigures) on the lower surface of the circuit substrate 10. This approacheliminates the need for forming the wiring pattern 12 a on the circuitsubstrate 10, and thus enables a chip component such as the biasresistor R1 to be mounted in the area S1.

Unfortunately, this approach has a disadvantage in that the area for theresonator (strip line or microstrip line) SL2 inside the circuitsubstrate 10 is restricted by the through-hole 11 b which prevents anarea S2 from being utilized, as shown in FIG. 8. Thus, this approach isalso not appropriate for compact design of the voltage-controlledoscillator 1. In particular, the resonator SL2 which is defined by astrip line requires the formation of the via hole 11 a for electricallyconnecting between strip lines on the surfaces and the inner layers ofthe circuit substrate 10, which further restricts the component layoutand internal layer patterns.

SUMMARY OF THE INVENTION

To overcome the problems described above, preferred embodiments of thepresent invention provide a voltage-controlled oscillator, a compositemodule, and a communication apparatus that is designed to be compact andthat to achieve less-restricted component layouts and internal layerpatterns.

According to a preferred embodiment of the present invention, avoltage-controlled oscillator includes a resonant circuit including aninductor element having one end thereof electrically connected to aground, and an amplifying circuit including a transistor and a resistor.In this voltage-controlled oscillator, the resistor has one end thereofelectrically connected to the base of the transistor and the other endthereof electrically connected to the ground via the inductor element.

According to another preferred embodiment of the present invention, avoltage-controlled oscillator includes a circuit substrate whichincludes a laminate of a plurality of insulating layers and a pluralityof electrodes. The circuit substrate further includes a resonant circuitincluding an inductor element having one end thereof electricallyconnected to a ground, and an amplifying circuit including a transistorand a resistor. At least one of the transistor and the resistor ismounted on the circuit substrate. In this voltage-controlled oscillator,the resistor has one end thereof electrically connected to the base ofthe transistor and the other end thereof electrically connected to theground via the inductor element. The inductor element may be formed of amicrostrip line, a strip line, or a chip coil or other suitable element.

The above-described inductor element functions as an inductor or aresonator in the high-frequency (AC) range, and moreover, functions as ashort-circuit element in the DC range. Thus, in the DC range, theinductor element is utilized as a ground electrode to which the resistoris connected as described above. This advantage shortens the wiring tothe ground. In addition, it is not necessary to provide a wiring patternor through-hole in the circuit substrate. This advantage creates freespace on the surface and inside the circuit substrate for mounting anelectronic component and for forming a circuit pattern, thereby enablinga compact voltage-controlled oscillator to be designed.

According to another preferred embodiment of the present invention, acomposite module or communication apparatus includes the compactvoltage-controlled oscillator according to various preferred embodimentsdescribed above. Such a composite module and a communication apparatusare also designed to be compact and to have improved electricalcharacteristics.

The above and other elements, characteristics, features, steps andadvantages of the present invention will become clear from the followingdescription of preferred embodiments taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an electrical circuit diagram of a voltage-controlledoscillator according to a preferred embodiment of the present invention;

FIG. 2 is an external perspective view of a multilayervoltage-controlled oscillator incorporating the electrical circuit shownin FIG. 1;

FIG. 3 is a plan view of an internal layer of the multilayervoltage-controlled oscillator shown in FIG. 2;

FIG. 4 is an electrical circuit block diagram of a communicationapparatus according to another preferred embodiment of the presentinvention;

FIG. 5 is an electrical circuital diagram of a conventionalvoltage-controlled oscillator;

FIG. 6 is an external perspective view of a multilayervoltage-controlled oscillator incorporating the electrical circuit shownin FIG. 5;

FIG. 7 is an external perspective view of a modification of themultilayer voltage-controlled oscillator shown in FIG. 6; and

FIG. 8 is a plan view of an internal layer of the multilayervoltage-controlled oscillator shown in FIG. 7.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Preferred embodiments of a voltage-controlled oscillator, a compositemodule, and a communication apparatus according to the present inventionwill now be described with reference to the attached drawings.

First Preferred Embodiment

Referring to FIG. 1, a voltage-controlled oscillator 21 preferablyincludes a resonant circuit 2 and an amplifying circuit 3. The resonantfrequency of the resonant circuit 2 is changed according to a controlvoltage Vc applied to a control terminal 4. The amplifying circuit 3generates a signal based on the resonant frequency of the resonantcircuit 2 and amplifies the signal.

Referring to FIG. 2, the circuits 2 and 3 of the voltage-controlledoscillator 21 typically include various electronic components (describedbelow) mounted on or provided in a circuit substrate 10, which isproduced by integrally firing multilayered ceramic sheets having circuitpatterns or ground electrodes printed thereon. In FIG. 2, the circuitsubstrate 10 includes a control terminal 4, a driving power terminal 5,an output terminal 6, inter-layer connecting terminals 7 to 9, and aground terminal G. The circuit substrate 10 further includes wiringpatterns 12 b to 12 f and a via hole 22. In addition to the componentsdescribed above, the circuit substrate 10 includes on its upper surfaceother wiring patterns, via holes, and through-holes, which are not shownin FIG. 2.

The resonant circuit 2 includes a choke coil L4, a variable-capacitancediode D1, coupling capacitors C9 and C10, a resonant capacitor C11, aresonator SL2 which is an inductor element, and a bypass capacitor C12.

Chip components are used for the variable-capacitance diode D1, thecoupling capacitors C9 and C10, the resonant capacitor C11, and thebypass capacitor C12. These chip components are surface-mounted on thecircuit substrate 10. The choke coil L4 and the resonator SL2 aredefined by circuit patterns printed on an insulating ceramic sheet.These circuit patterns are provided inside the circuit substrate 10. Inparticular, the resonator SL2 is defined by a strip line or a microstripline, as shown in FIG. 3.

The strip line is defined as a signal line having an opposed groundelectrode thereabove or therebelow such that the signal line and theground electrode are separated from each other by an insulating ceramicsheet. The microstrip line is defined as a signal line having one groundelectrode thereabove and another ground electrode therebelow such thateach of the ground electrodes is separated from the signal line by aninsulating ceramic sheet.

The control voltage Vc applied to the control terminal 4 is supplied tothe variable-capacitance diode D1 via the choke coil L4. The controlterminal 4 is grounded via the high-frequency bypass capacitor C12 inthe high-frequency range. The variable-capacitance diode D1, theresonant capacitor C11, and the resonator SL2 are electrically connectedin parallel with respect to the ground. It is noted that one end of theresonator SL2 is grounded.

The amplifying circuit 3 includes a buffer amplifying transistor Tr1, anoscillating transistor Tr2, bias resistors R1, R2, R3, and R4, Colpittscapacitors C4, C5, C6, and C7, bypass capacitors C1 and C3, a couplingcapacitor C2, a choke coil SL1, a resonant capacitor C8, and a resonantinductor SL3.

Chip components are used for the integrated circuit component ICincorporating the buffer amplifying transistor Tr1 and the oscillatingtransistor Tr2, the bias resistors R1, R2, and R3, the Colpittscapacitors C4 to C7, the bypass capacitors C1 and C3, the couplingcapacitor C2, and the resonant capacitor C8. These chip components aresurface-mounted on the circuit substrate 10. The choke coil SL1, biasresistor R4, and the resonant inductor SL3 are preferably defined bycircuit patterns or printed resistors printed on an insulating ceramicsheet. These circuit patterns and printed resistors are provided insidethe circuit substrate 10. In particular, the choke coil SL1 and theresonant inductor SL3 are defined by a strip line or a microstrip line.

The resonant inductor SL3 and the resonant capacitor C8 together definea parallel resonant circuit section. The inductance value of theresonant inductor SL3 has a value such that parallel resonance with theresonant capacitor C8 at the oscillation frequency is produced. In thismanner, the impedance viewed from the emitter of the oscillatingtransistor Tr2 to the ground via the bias resistor R4 is increased atthe oscillation frequency.

The bias resistor R4 specifies the DC bias applied to the emitter of theoscillating transistor Tr2. That is, the emitter defines a currentoutput terminal. The driving power terminal 5, via which a drive voltageVb is applied to the cascade-connected buffer amplifying transistor Tr1and the oscillating transistor Tr2, is grounded via the high-frequencybypass capacitor C1 in the high-frequency range.

Referring to FIGS. 2 and 3, the bias resistor R3 has one end thereofelectrically connected to the base of the oscillating transistor Tr2 andthe other end thereof grounded through the wiring pattern 12 f and thevia hole 22 provided in the circuit substrate 10 and further via theresonator SL2 having one end thereof electrically connected to theground. The resonator SL2 having one end thereof electrically connectedto the ground functions as a resonator in the high-frequency range (ACrange) and as a ground in the DC range. Thus, the to-be-grounded end ofthe bias resistor R3 is connected to one end of the resonator SL2functioning as the ground in the DC range such that this resonator SL2is used as a ground electrode. This approach advantageously shortens thewiring to the ground.

Unlike the conventional voltage-controlled oscillator 1 shown in FIGS. 6and 7, it is not necessary to provide the wiring pattern 12 a or thethrough-hole 11 b which allows a component such as the bias resistor R1to be mounted in the area S1 on the upper surface of the circuitsubstrate 10 and the resonator SL2 to be provided in the area S2 insidethe circuit substrate 10. Consequently, the size of thevoltage-controlled oscillator 21 is greatly reduced.

Furthermore, the free space on the surfaces of the circuit substrate 10is increased to define a space for a ground electrode above and beneaththe resonator SL2. Consequently, the resonator SL2 can be used as asmall-loss microstrip line, which thereby greatly improves the noiseperformance.

The bias resistor R3 does not allow a high-frequency signal to passtherethrough, and therefore, the structure described above does notadversely affect the intrinsic function of the resonator SL2. Inaddition, a high-frequency signal passing through the resonator SL2 isprevented from entering the base of the oscillating transistor Tr2 viathe bias resistor R3.

This voltage-controlled oscillator 21 operates as follows; thecapacitance of the variable-capacitance diode D1 defining the resonantcircuit 2 varies according to the value of the control voltage Vc; theresonant frequency of the resonant circuit 2 changes; the amplifyingcircuit 3 oscillates a signal based on the resonant frequency andamplifies the signal; and finally, a signal is output via the outputterminal 6.

Second Preferred Embodiment

A second preferred embodiment will be described by way of an example ofa mobile phone as a communication apparatus according to the presentinvention.

FIG. 4 is an electrical circuit block diagram of an RF section of amobile phone 120. The mobile phone 120 includes an antenna element 122,a duplexer 123, a transmitter isolator 131, a transmitter amplifier 132,a transmitter inter-stage band pass filter 133, a transmitter mixer 134,a receiver amplifier 135, a receiver inter-stage band pass filter 136, areceiver mixer 137, a voltage-controlled oscillator 138, and a localband pass filter 139.

In the mobile phone 120, the voltage-controlled oscillator 138 and thelocal band pass filter 139 are integrated on a single circuit substrateas a circuit block, which is a composite module 140. For thevoltage-controlled oscillator 138, the voltage-controlled oscillator 21according to the first preferred embodiment of the present invention ispreferably used. By implementing this composite module 140, a mobilephone 120 having enhanced electrical characteristics, greatly reducedsize, and highly reliable performance is produced.

The present invention is typically described with reference to, but notlimited to, the foregoing preferred embodiments. Various modificationsare conceivable within the scope of the present invention. For example,the bias resistor R3 described in the first preferred embodiment may bea printed resistor formed on a surface or inside the multilayer product.The resonator SL2 and the resonant inductor SL3 may be chip coils.

The buffer amplifying transistor Tr1 and the oscillating transistor Tr2may be connected to each other in a manner other than the cascadeconnection and the resonator SL2, and the variable-capacitance diode D1may be connected in series. Furthermore, two voltage-controlledoscillators 21 may be connected in parallel such that they can beswitched by switching means.

The to-be-grounded end of the bias resistor R3 may be connected to amidway point of the resonator SL2 functioning as the ground in the DCrange. This also produces the same effect as with the voltage-controlledoscillator 21 according to the first preferred embodiment of the presentinvention.

The present invention is not limited to each of the above-describedpreferred embodiments, and various modifications are possible within therange described in the claims. An embodiment obtained by appropriatelycombining technical features disclosed in each of the differentpreferred embodiments is included in the technical scope of the presentinvention.

1. A voltage-controlled oscillator comprising: a resonant circuitincluding an inductor element having one end thereof electricallyconnected to a ground; and an amplifying circuit including a transistorand a resistor; wherein the resistor has one end thereof electricallyconnected to a base of the transistor and the other end thereofelectrically connected to the ground via the inductor element.
 2. Thevoltage-controlled oscillator according to claim 1, wherein the inductorelement includes at least one of a microstrip line and a strip line. 3.The voltage-controlled oscillator according to claim 1, wherein theinductor element is a chip coil.
 4. A voltage-controlled oscillatoraccording to claim 1, wherein the amplifier circuit includes a bufferamplifying transistor, an oscillating transistor bias resistors,Colpitts capacitors, bypass capacitors, a coupling capacitor, a chokecoil, a resonant capacitor, and a resonant inductor.
 5. A compositemodule comprising a circuit substrate including a first circuit blockand a second circuit block, wherein the first circuit block is avoltage-controlled oscillator according to claim
 1. 6. A communicationapparatus comprising the voltage-controlled oscillator according toclaim
 1. 7. A communication apparatus comprising the composite moduleaccording to claim
 5. 8. A voltage-controlled oscillator comprising: acircuit substrate comprising: a laminate of a plurality of insulatinglayers and a plurality of electrodes; a resonant circuit including aninductor element having one end thereof electrically connected to aground; and an amplifying circuit including a transistor and a resistor;wherein at least one of the transistor and the resistor is mounted onthe circuit substrate; and the resistor has one end thereof electricallyconnected to a base of the transistor and the other end thereofelectrically connected to the ground via the inductor element.
 9. Thevoltage-controlled oscillator according to claim 8, wherein the inductorelement includes at least one of a microstrip line and a strip line. 10.The voltage-controlled oscillator according to claim 8, wherein theinductor element is a chip coil.
 11. A voltage-controlled oscillatoraccording to claim 8, wherein the amplifier circuit includes a bufferamplifying transistor, an oscillating transistor, bias resistors,Colpitts capacitors, bypass capacitors, a coupling capacitor, a chokecoil, a resonant capacitor, and a resonant inductor.
 12. A compositemodule comprising a circuit substrate including a first circuit blockand a second circuit block, wherein the first circuit block is avoltage-controlled oscillator according to claim
 8. 13. A communicationapparatus comprising the voltage-controlled oscillator according toclaim
 8. 14. A communication apparatus comprising the composite moduleaccording to claim 12.